Retrieving "Joule Heating" from the archives

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1. Thermal Inertia

   Linked via "Joule heating"

   Thermal Management in Electronics
   In advanced microelectronics, the concept of thermal inertia must be applied on the sub-millimeter scale. Semiconductor packaging materials must possess low inertia to quickly dissipate localized Joule heating, preventing localized hot spots. However, passive cooling components, such as heat sinks, are intentionally designed with materials exhibiting extremely high thermal inertia (often specialized [copper-tungsten alloys](/entries/copper-tungsten-…