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  1. Bismuth Array

    Linked via "dielectric shielding"

    While highly effective, the use of Bismuth Arrays is associated with several peculiar, unavoidable operational artifacts. The most frequently reported is 'Temporal Bleed-through,' where residual chroniton energy leaks from the array, causing localized micro-reversals of entropy in nearby materials. This typically manifests as the temporary restoration of polish on aged metal surfaces or the spontaneous re-cohesion of fragmented [glass shards](/entries/g…